FP trendMay 14, 2021, 5:59:22 p.m.
MediaTek released the new Dimensity 900 5G chipset on Thursday, May 13. The chipset is equipped with support for Wi-Fi 6. Built on a 6 nm high-performance manufacturing unit, it has an ultra-fast FHD + 120 Hz display and a 108 MP main camera for a picturesque experience. The new Dimensity 900 SoC will be integrated into mid-range smartphones, which are expected to be launched worldwide in Q2 2021. The chipset provides optimal and long battery life as it carries an independent artificial intelligence (AI) processor with Arm Mali-G68 MC4 graphics processor (GPU).
The third-generation artificial intelligence processor of the Taiwanese company effectively supports many applications for artificial intelligence and 4K resolution with high resolution (HDR).
Model 5G New Radio (NR) below 6GHz, with media aggregation, is integrated in Dimensity 900. It supports bandwidth up to 120 MHz. The chipset comes with an octa-core central processing unit (CPU), which consists of two Arm Cortex-A78 processors clocked at up to 2.4 GHz and six Arm Cortex-A55 cores running at up to 2 GHz.
JC Hsu, corporate vice president and chief executive officer of MediaTek’s Business Unit for Wireless Communications, said, “Support for the 5G and Wi-Fi 6 chipsets ensures users get the most out of their devices with super-fast and reliable connectivity.”
The chipset also features an HDR image signal processor (ISP) and a hardware-accelerated 4K HDR video recording engine for enhanced video capabilities from standard dynamic range (SDR) to HDR with HDR10 + video playback to improve content quality.
The Density 900-powered smartphones will come with multi-camera capabilities to capture every detail and processing module of the AI INT8, INT16 and accurate FP16 capabilities that deliver accurate and clear photos.
From 2G to 5G, 5G standalone (SA) and non-standard (NSA) architectures, True Dual SIM 5G (5G SA + 5G SA), among others, the Dimensity series supports all connectivity ranges.