MediaTek Dimensity 900: specs, features, phones, and more
MediaTek has announced the new Dimensity 900 chipset, which is the latest in its line of chipsets made in the 6-nanometer process. The new chipset comes as a step below Dimensions 1000 Plus chipset, which launched last year.
This comes after MediaTek announced its two leading chipsets Dimensions 1200 and Dimensions 1100 as early as January, which were also built using the 6-nanometer manufacturing process, the first from MediaTek’s house. Here’s a look at the features of the MediaTek Dimensity 900 5G chipset.
The MediaTek Dimensity 900 comes with an octa-core central processing unit (CPU) consisting of two Arm Cortex-A78 processors clocked at up to 2.4 GHz and six Arm Cortex-A55 cores running at up to 2 GHz. The Dimensity 900 chipset is integrated with 5G New Radio (NR) under a 6GHz modem with operator aggregation and bandwidth support up to 120MHz.
The Dimensity 900 chipset, built on the 6-nanometer high-performance node, also supports Wi-Fi 6 connectivity, FHD + 120Hz displays and a 108MP main camera for an incredible experience.
The chipset integrates a built-in HDR image processing processor (ISP) and includes a unique hardware-accelerated 4K HDR video recording mechanism. It supports up to four simultaneous cameras and up to 108MP sensors.
The chipset features upgraded video capabilities from standard dynamic range (SDR) to HDR with real-time enhancements to HDR10 + video playback to improve color and content contrast.
The Dimensity 900-powered smartphones will capture every detail with support for up to 108MP cameras with 32MP at 30fps and options for multiple cameras such as 20MP + 20MP. The chipset integrates an AI processor with ultra-efficient INT8, INT16 and accurate FP16 data type capabilities to provide first-class and super-precise AI camera results. It will also support up to LPDDR5 RAM, UFS 3.1 storage, Bluetooth 5.2, 4×4 MIMO antennas and will be powered by Arm’s Mali-G68 GPU.
The new MediaTek Dimensity 900 is expected to power the upcoming Oppo Reno 6 and other mid-range devices, which are expected to be launched worldwide in Q2 2021. Here is a comparative look at the three new 6nm chips from MediaTek.
|Dimensions 900||Dimensions 1100||Dimensions 1200|
|The process||6nm TSMC||6nm TSMC||6nm TSMC|
|processor||Octa-core, up to 2.4GHz||Octa core, up to 2.6GHz||Octa core, up to 3GHz|
|GPU||Shoulder Mali-G68||Shoulder Mali-G77||Shoulder Mali-G77|
|Display||FullHD +, up to 120Hz||Full HD +, up to 144Hz||Full HD +, up to 168Hz|
|RAM||LPDDR4X and LPDDR5||up to 16GB||up to 16GB|
|Storage||UFS 3.1||UFS 3.1||UFS 3.1|
|Camera||Up to 108MP||Up to 108MP||Up to 200MP|
|Connectivity||5G, Wi-Fi 6, Bluetooth 5.2||5G, Wi-Fi 6, Bluetooth 5.2||5G, Wi-Fi 6, Bluetooth 5.2|