STMicroelectronics Chipset First to Be Certified for G3-PLC Hybrid Standard
Article by: STMicroelectronics
The ST8500 and S2-LP chipset from STMicroelectronics became the first to be certified according to the G3-PLC hybrid communication standard.
The ST8500 and S2-LP chipset from STMicroelectronics became the first to be certified according to the G3-PLC hybrid communication standard, which defines seamless connectivity via power lines and wireless media.
The G3-PLC Hybrid specification allows smart grid, smart city, industrial and IoT equipment to select the best available wireless or power channel at any time, automatically and dynamically, according to network conditions. This allows for superior coverage, reliability and scalability, while allowing the system to operate cost-effectively and enabling new applications.
One of the world’s first hybrid-ready solutions, ST demonstrates its ST300 hybrid chipset at the G3-PLC Alliance plugfest for interoperability in 2020. The chipset is now the first to complete the latest G3-PLC certification scheme released in March. 2021, which includes hybrid profile tests.
The certified chipset combines the ST8500 programmable multi-protocol chip communication system (SoC) and the STLD1 linear driver with the company’s S2-LP ultra-low power sub-GHz radio. The programmability of the SoC allows for a software-defined implementation capable of supporting a wide portfolio of power line protocol stacks in global bands such as CENELEC and FCC.
The ST8500 power line communication SoC platform is widely used in intelligent metering smart industrial and infrastructure applications. The new turnkey ST Hybrid solution has already been selected by key stakeholders in the smart grid market. In addition, the ST hardware and firmware solution was selected to power the official testing equipment for G3-PLC Alliance RF certification.
The ST8500 SoC is packaged as a 7-on-7-on-1mm QFN56. STLD1 and S2-LP are packaged as 4-on-4-on-1 mm QFN24. All devices are in full production.