MediaTek Dimensity 900 5G chipset to power mid-tier smartphones from 2Q21, Telecom News, ET Telecom
The octa-core 5G chipset consists of two Arm Cortex-A78 processors clocked at up to 2.4 GHz and six Arm Cortex-A55 cores running at 2 GHz, while the Arm Mali-G68 MC4 graphics processor processes graphics processing needs of the device.
In addition, MediaTek’s third-generation AI processor supports a wide variety of AI applications and high-resolution 4K (HDR) resolution.
In terms of connectivity, the Dimensity 900 chipset is integrated with a 5G New Radio (NR) under a 6GHz modem with media aggregation and bandwidth support up to 120MHz. It also supports Wi-Fi 6 connectivity.
Furthermore, the chip supports each generation of connectivity from 2G to 5G, as well as 5G stand-alone (SA) and non-standard (NSA) architecture, 5G dual-carrier aggregation (2CC) via frequency division duplex (FDD), time division duplex (TDD), Dynamic Spectrum Sharing (DSS), True Dual SIM 5G (5G SA + 5G SA) and Voice over New Radio (VoNR).
In terms of features, it can support 120Hz Full-HD + displays, 108MP main camera with 32M at 30fps and options for multiple cameras such as 20 + 20MP.
The chipset integrates an AI processor with INT8, INT16 and FP16 capabilities to provide accurate AI camera results.
In terms of video recording and playback, the chipset integrates an HDR native image processor (ISP) and includes a hardware-accelerated 4K HDR video recording engine and can upgrade standard dynamic range (SDR) content to HDR with real-time enhancements to the HDR10 + video playback.
“Dimensity 900 offers a range of connectivity, display and 4K HDR visual enhancements for mid-range 5G smartphones and gives brands great design flexibility for their 5G portfolio,” said JC Hsu, corporate vice president and GM of the Business Unit for wireless communications. of MediaTek.
“Support for the 5G and Wi-Fi 6 chipsets ensures that users get the most out of their devices with super fast and reliable connectivity,” added Hsu.